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Physical Design Automation for Through-silicon-via (TSV) Based 3D Integrated Circuits

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Physical Design Automation for Through-silicon-via (TSV) Based 3D Integrated Circuits

Author:   Sung Kyu Lim
Publisher:   Springer-Verlag New York Inc.
Edition:   2012
ISBN:  

9781441995414


Pages:   300
Publication Date:   30 April 2012
Format:   Hardback
Availability:   Not yet available   Availability explained
This item is yet to be released. You can pre-order this item and we will dispatch it to you upon it's release.
Online Price $171.55 RRP $194.95 Save $23.40 (12.00%) Quantity:  
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Author:   Sung Kyu Lim
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Country of Publication:   United States
Edition:   2012
ISBN:  

9781441995414


ISBN 10:   1441995412
Pages:   300
Publication Date:   30 April 2012
Audience:   College/higher education ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Forthcoming
Availability:   Not yet available   Availability explained
This item is yet to be released. You can pre-order this item and we will dispatch it to you upon it's release.

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